Cadence® views IC packaging as the critical link in the silicon-to-package-to-board design flow. Without this link, it's easy to design silicon that is difficul or expensive to implement into a system . The Allegro® Package co-design 600 series, part of the Allegro system interconnect design platform, moves chip/package co-design and analysis capability to a new level.
The new Allegro Package 620 series combines the industry's leading package tools-the Allegro 610 series—with new chip-level I/O feasibility and planning capabilities. The 620 series builds on the proven 610 series, offering all the features and functionality that have you have come to expect from Cadence in an enhanced solution.
In addition, the 620 series is also the first product released in the new 600 co-design series that has an embedded technology leading 3D field solver. The 3D field solver is directly integrated with the SPICE-based signal integrity simulation and exploration environment from Allegro Package SI 620 to help designers trade off electrical performance versus size and cost. As performance targets for today's devices increase, demand for more accurate models grows. Cadence is committed to meeting those demands today and in the future. |
| |
| Key benefits |
 |
The Allegro Package Designer 620 product provides a clear migration path for current Allegro Package Designer 610 designers who need a higher degree of IC/package co-design capability so they can reduce package cost and still meet performance targets. |
|
New ECO flow and die editing tools can be leveraged to support a true package-driven flow where the designer wants to optimize the I/Os at the die bump level to fit an existing package or to optimize a custom package. |
|
Like the 610 product, Allegro Package Designer 620 supports a full package design flow from design capture through manufacturing output, supporting all the industry standards. |
|
Integrated design and analysis environment for making physical, electrical performance, and cost trade-offs easily and accurately. |
|
Embedded, proven 3D field solver avoids having to deal with design setup and difficult-to-use standalone post-layout analysis tools |
|
Allegro Package SI 620 reads and writes Allegro Package Designer 610 and 620 design databases, ensuring that design elements or intent is not lost in translations |
|
Integrates smoothly into the Cadence Encounter™ platform ECO flow via LEF/DEF |
|
|
