LPKF MicroLine UV 3000i
Laser system for depaneling of populated boards
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 The LPKF MicroLine UV 3000i system is based on the LPKF MicroLine UV 3000. The UV laser system cuts flexible and rigid-flexible circuit boards as well as cover foils.
The LPKF Microline UV 3000i uses a unique exhaust and cutting configuration which allows for cutting with up to 30 mm between the substrate and the non-moving parts of the cutting system. Circuits populated with high SMD components can be cut easily. The non-contact process protects sensitive parts. The system is equipped with a handling interface and can be adapted to all kinds of handling options.
With a sealed housing and a small footprint, the system can be easily integrated into an existing production line. |
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