PCP-303SL, actualized the handler inspection of the small package baseplate (BGA and QFN etc) which the dicing is done with [purobingu] system.

Actualization possible [maruchipurobingu] improves throughput rapidly with adoption of [purobingu] system

Features

• Probing area: Inside 300mm
• Frame: For wafer size 300mm
• X-Y linear motor stage of high accuracy
• The XY position revision with sampling
• Plural loading correspondences and multiple area alignment
• Even in small tip/chip below 1mm corresponding possibility
• Small space: W1450mm x D1000mm