PCP-103SL made the inspection of Small-sized package circuit base board with Handler (BGA, QFN etc.) by Probing method.

Throughput has drastically improved by applying this Probing method possible for Multi-probing.

Features

• Probing Area : φ200mm, XY Square 230 × 200 Max
• Frame Size : Frame for Wafer Size 150mm(2-6-1), 200mm(2-8-1)
• X & Y linear motor technology for maximum precision.
• XY Position compensation function by Sampling.
• Possible for loading more than One Board.Multi-area Alignment function.
• Correspond to small Chip less than 1mm.
• Small Space : W1100mm × D860mm