| Test Items |
Performance |
Remarks |
| PCT Resistance |
No Peeling/No Peeling |
121°C/Saturation/50/100hrs |
| Acid Resistance |
No Peeling/No Peeling |
10vol%H2SO4Room Temp/30/60min |
| Alkaline Resistance |
No Peeling/No Peeling |
10wt%NaOH Room Temp/30/60min |
| Solvent Resistance |
No Peeling/No Peeling |
PGM-Ac Room Temp. 30min |
| Solder Heat Resistance |
No Peeling |
SF-270 260°C/20sec./3cycles |
| Insulation Resistance |
Initial: 4.4E+13 ohm
Humidified: 5.8E+12 ohm |
25-65°C/90%RH/DC 100V
Measured at room temp./DC500V
7days conditioned above. |
| Dielectric Constant |
Initial: 4.1
Humidified: 4.1 |
Value at 1MHz |
| Dissipation Factor |
Initial: 0.020
Humidified: 0.023 |
Value at 1MHz |
PCBT (Electro Migration)
PCBT |
No Migration
Initial: 2.4E+14 ohm
Humidified: 1.4E+13 ohm |
121°C/97%RH/DC30V/96hrs
L/S=100um/100um |
| Ni/Au Resistance |
No Peeling |
Ni: 3um Au: 0.03um |
