PSR-400 SG100HF
|
PSR-4000 GHP3
|
PSR-4000 AM
|
LDI-1000FZ
|
PSR-4000 AUS
|
PFR-800 AUS402
PSR-4000 AUS10
|
HBI-200B
|
HBI-200D
|
Tf-200
|
FC Hard UVCF-535G
|
LFI-900B
|
PSR-4000 FLX101
Liquid Dielectrics for HDI
HBI-200B Series and CCF-300A Series
Main Features
HBI-200B
Hogh and stable Peel Strength
Accurate Registration (No Need for Conformal Mask)
Easy Multi-Layering
fine Pattering
Fast Laser Ablation
Cost down (Material and Process)
Coating Method: Screen, Rurtain, Roll-Cating
CCF-300A Series
New Process "Coat & Copper Foil Laminate"
Easy Press Control
Excellent Co-planarity for Multi-layer
Cu Foil Type and Thickness as Your Choice
Use as Prepeg Adhesive
Test Items
HBI-200B Series
Ex. HBI-200BK1
CCF-300A Series
Ex. CCF-300AS
Process
Resin etching and plating
Cu foil press
Tg (TMA/DMA)
125°C/140°C
125°C/135°C
CTE (ppm) below Tg
above Tg
70-80
145-160
55-70
160-170
Dk (1GHz)
3.5
3.6
Df (1GHz)
0.022
3.6
Young's modulus (GPa)
2.0
0.029
Tensile Strength (MPa)
50
68
Elongation strength
8-10
6-7
Peel Strength(N/cm)
>12 (25um Copper plating)
>13 (18um VLP Copper foil)
PSR-400 SG100HF
|
PSR-4000 GHP3
|
PSR-4000 AM
|
LDI-1000FZ
|
PSR-4000 AUS
|
PFR-800 AUS402
PSR-4000 AUS10
|
HBI-200B
|
HBI-200D
|
Tf-200
|
FC Hard UVCF-535G
|
LFI-900B
|
PSR-4000 FLX101
Visit Taiyo Ink Webbsite:
www.taiyoink.co.jp
For more information about this product, please call: (632) 6713892
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