| Test Items |
Performance |
Remarks |
| Track Dry Window |
80min. |
80°C |
| Resolution |
50µm |
300mJ/cm2 on ink |
| Adhesion |
100/100 |
Cross-Hatch Tape Peeling |
| Pencil Hardness |
6-7 H |
IPC-840 3.5.1 |
| Solder Heat Resistance |
3 Cycles |
260° 10sec. / Cycle |
| Solvent Resistance |
No Peeling |
PGM-Ac 20min. Immersion & Pel |
| Acid Resistance |
No Peeling |
H2SO4 10vol% 20 min. Immersion |
| Alkaline Resistance |
No Peeling |
NaOH 10 wt% 20 min. Immersion |
| Ni/Au Resistance |
No Peeling |
Ni : 3um Au : 0.03um |
| Immersion Sn Resistance |
No Peeling |
Sn : 0.5 um |
| Hydrolytic Stability / Aging |
No change of state |
IPC-840C 3.6.2 |
| Dielectric Strength |
3.0KV/mil |
IPC-840C 3.8.1 |
| Dielectric Constant |
Initial 4.1 |
Humified 4.2 |
Value at 1MHz |
| Dissipation Factor |
Initial 0.024 |
Humified 4.2 |
Value at 1MHz |
| Insulation Resistance |
BFR Soldering
AFT soldering |
5.4E+14Ω
3.8E+13Ω |
IPC-840C 3.8.2
IPC-B-25 Test Pattern |
| Moisture & Insulation |
Initial |
5.4E+12 ohm |
IPC-840C 3.9.1 |
| Resistance |
Treated |
3.6e+12 ohm |
IPC-B-25 Test Pattern |
| Resistance |
Treated |
3.6E+12 ohm |
IPC-840C 3.9.2 |
| Electro-Migration |
No Migration
Treated |
3.6E+12 ohm |
IPC-840C 3.9.2
IPC-B-25 Test Pattern |
